💻 ** Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration **

The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.

🔗 https://www.tomshardware.com/tech-industry/semiconductors/sk-hynix-shares-surge-to-all-time-high-on-reports-of-intel-emib-partnership

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