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💻 ** TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking **
TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.
🔗 https://www.tomshardware.com/tech-industry/semiconductors/tsmc-soic-3d-stacking-roadmap-outlines-path-from-6-micron-pitches-today-to-4-5-micron-in-2029-fujitsus-monaka-cpu-to-benefit-from-face-to-face-chiplet-stacking
#tech #news
TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.
🔗 https://www.tomshardware.com/tech-industry/semiconductors/tsmc-soic-3d-stacking-roadmap-outlines-path-from-6-micron-pitches-today-to-4-5-micron-in-2029-fujitsus-monaka-cpu-to-benefit-from-face-to-face-chiplet-stacking
#tech #news